Components / New Products

Data Sheet: Introduction to Anaren's 433MHz AIR module based on TI's CC1101 low-power RF chip... more

Data Sheet: Introduction to Anaren's 868MHz AIR module (embedded antenna) based on TI's CC1101 low-power RF chip... more

Data Sheet: Introduction to Anaren's 868MHz AIR module (connectorized for whip antenna) based on TI's CC1101 low-power RF chip... more

Data Sheet: Introduction to Anaren's 915MHz AIR module (embedded antenna) based on TI's CC1101 low-power RF chip... more

Data Sheet: Introduction to Anaren's 915MHz AIR module (connectorized for whip antenna) based on TI's CC1101 low-power RF chip... more

Data Sheet: Introduction to Anaren's 2.4GHz AIR module (embedded antenna) based on TI's CC2500 low-power RF chip... more

Data Sheet: Introduction to Anaren's 2.4GHz AIR module (connectorized for whip antenna) based on TI's CC2500 low-power RF chip... more

Data Sheet: Introduction to Anaren's wireless audio AIR module based on TI's CC8520 low-power SOC and CC2591 range extender... more

Webcast: Die bonders can perform epoxy die attach at a rate of 1.5 to 4 thousand die per hour, and wire bonders can interconnect complex packages at speeds of more than 10 wires per second. There is one major concern with operating at these speeds: if something in the assembly process is wrong, everything... more

Webcast: This presentation will go over some of the common issues encountered when setting up performing circuit simulation of high speed serial designs. Topics will include s-parameter passivity and causality, frequency sampling and bandwidth and how they relate to simulation accuracy, model... more