Palomar Technologies, formerly Hughes Aircraft, is the global leader of die attach solutions, wire bonding equipment, optoelectronic packaging systems and precision assembly services. Palomar Technologies' award winning automated high-precision assembly systems enable customers to increase yield and reduce costs in the manufacturing of LED, optoelectronic, solar, RF and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, defense, medical and life sciences industries. Palomar Technologies is the single global provider of a highly customized advanced packaging product set, combined with high-accuracy wire bond and die attach services. Customers worldwide draw upon Palomar Technologies' expertise, decades of process knowledge and a rich history of successful OEM advanced packaging capabilities.
Webcast: Die bonders can perform epoxy die attach at a rate of 1.5 to 4 thousand die per hour, and wire bonders can interconnect complex packages at speeds of more than 10 wires per second. There is one major concern with operating at these speeds: if something in the assembly process is wrong, everything... more